| Url |
https://cimne.com/sgp/rtd/Project.aspx?id=518 |
|
| Acronym |
EMCPack |
| Project title |
Modelling and Simulation of Parasitic Effects (EMC/SI/RF) for Advanced Package Systems in Aeronautic and Automotive Applications |
| Reference |
|
| Principal investigator |
Eugenio OÑATE IBAÑEZ DE NAVARRA - onate@cimne.upc.edu
|
| Start date |
01/10/2003 |
End date |
30/09/2006 |
| Coordinator |
FRAUNHOFER IZFP - No válido |
| Consortium members |
- AIRBUS FRANCE
- CIMNE
- COMPASS ING. Y SISTEMAS, S.A.
- SIEMENS
- INSA
- PHILIPS
- BOSCH
- FHG
- EADS GIE
|
| Program |
PIIC |
Call |
|
| Subprogram |
PIDEA |
Category |
Europeo |
| Funding body(ies) |
EC |
Grant |
$0.00 |
| Abstract |
This project aims at developing new methodology and tools for addressing system integration, design and qualification of advanced packages under EMC/ESD/RF constraints for applications related to the automotive and aeronautic domains. On introducing a new higher performance electonic modules in automotive and aeronautic applications, one is confronted with the task to assure a short time to market combined with optimised system reliability. This requires improved functionality at the system design level including consideration of high density interconnect (HDI)/high density packaging(HDP) as well as the integration of passive elements, EMC protection devices and optimised interconnect systems. As a matter of fact the trend for using higher frequencies (above Ghz ) together with direct advanced packaging and coupling structures means that elements like small PCBs or chip packages that were not concerned in the past, now present sizes that allow them to be considered either as antenna radiating energy or as coupling receiver elements for impinging electromagnetic waves. |
